Product Specifications

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Product Description

Product design for half-cell battery components

The internal structure design of the half-chip assembly includes three methods: series structure, series-parallel structure, parallel-series structure, etc. The conventional components usually adopt a series structure, and the voltage is unchanged because the current is halved after half-chip battery dicing. Therefore, if a series structure is used for design, the component voltage will be double that of the conventional components, which will increase the cost of the system. At the same time, there is a certain safety risk after the component voltage is doubled, so the overall output voltage and current are consistent with the conventional components. The half-chip battery assembly is generally designed in a series-parallel structure, which is equivalent to two small components connected in parallel. 

As shown in Fig. 2, the half-sheet battery assembly is the same as the conventional components, and is packaged by a back plate such as tempered glass, EVA, and TPE (TPT, EPE). The junction box will be different, generally using a three-part junction box. In the process, the half-piece component process is simple to change. Since the number of cells is doubled, the time for serial welding of the battery is doubled. The difficulty is that the bus-out lead wire is taken out from the middle of the back of the component. If it is manually operated, the lead-out wire will be raised. At the risk of battery rupture or cracking, the current automation problem of the busbar welding in the middle of the half-piece assembly has been overcome, and to some extent, the rapid development of the half-cell battery assembly has also been promoted.

Half-sheet battery pack features

Compared with the traditional components, the half-chip battery assembly is mainly manifested in three aspects. As shown in Table 1, the package efficiency is improved due to the reduction of internal circuit and internal consumption; the operating temperature of the component is lowered, the hot spot probability is greatly reduced, and the reliability of the component is improved. Sex and safety. In terms of shadow occlusion, due to its unique design, it exhibits excellent anti-blocking performance compared to conventional components.

Half-chip technology has the following characteristics:

First, the efficiency of a half-piece photovoltaic module with the same efficiency is significantly higher than that of a conventional full-chip component. This is mainly due to the reduction of the series resistance of the half-chip components and the improvement of the fill factor FF. At the same time, the internal resistance of the component is reduced, so that the temperature during power generation is lower than that of the conventional component, thereby further improving the power generation capability of the component.  

Second, the half-chip assembly can reduce the power generation loss caused by the occlusion, and can significantly increase the power generation of the assembly in the morning and evening and the assembly along the ash and snow, and improve the economic efficiency of the power station.

Third, compared with other new technologies, the half-chip technology is the most mature and the easiest to achieve rapid mass production, while the additional cost is not much.

The JDSOLAR half-chip battery pack has the following features:

(1) The battery chip is divided into two, the main gate current is halved, the current loss of the whole component is reduced to 1/4 of the original, and the output power is about 5-10W higher than that of the same type of whole battery assembly;

(2) The hot spot temperature of the half-chip battery assembly is lower than the temperature of the same-type full-piece battery assembly by about 25 ° C, which can effectively reduce the hot spot effect of the component;

(3) Half-chip battery components meet the 1500V system voltage design requirements, which can reduce the system-side cost by about 10%;

(4) When there is ash or snow on the occlusion and the lower edge, the loss of power generation caused by occlusion is effectively reduced;

(5) Reduce the first year and the average photoinduced attenuation;

(6) 100% PIDFree.  

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