Product Specifications

Type

Poly

Product Description

Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .

Features:

1.High conversion efficiency resulting in superior power output performance.

2.Outstanding power output even in low light or high temperature conditions

3.Optimized design for ease of soldering and lamination

4.Long-term stability,reliability and performance

5.Output power tolerance of +/-3%

Physical characteristics:

Dimension          156.75mm*156.75mm+0.5mm

Thickness            wafer(si):200um+30um

                                           180um+30um/-20um

Front(-)               Three 1.5mm wide bus bars (silver) with distance 52mm,

                            alkaline textureized surface with dark blue silicon nitride AR coating.

Back(+)               3.0mm wide silver/aluminum soldering pads, aluminum back surface field.

Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC

Temperature Coefficients

TKVoltage:-0.32 % / °C

TKCurrent:+0.02 % / °C

TKPower:-0.45 % / °C

Electrical  characteristics

Features of polycrystalline silicon solar cell poly:

High conversion effiency

Low power tolerance of 0~+3%

Low degradation under light exposure

Withstand high wind-pressure, snow load and extreme temperature

Passing IEC 61215 2400Pa mechanical load test

Quality and safety

10-year warranty on product materials and processing technology

Power output warranty:10 year: 90%, 25 year: 80%

ISO 9001:2008(Quality Management System) certificated factory

IEC61215,IEC 61730,MCS,CEC certificated product

TUV,CE conformity

Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight. 

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.

Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.

Supply Ability

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Packaging and Shipping

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Packaging details

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