Product Specifications

Type

Poly

Product Description

Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .

Features:

Performance and Quality

Industry-Leading Efficiency on P-type Monocrystalline Silicon Solar cell

Robust Reliability Performance for Potential Mudule Benefit Beyond 25 years

Compatible with Present Module Manufactureing Process

PID Resistant Confirmed by All Major Customers and testing Labs

100% In-line Optical and Electrical Inspection

                                       Mono-Crystalline Silicon Solar Cell 4BB

Physical Characteristics

Dimension          156.75mm*156.75mm ± 0.25mm

Thickness            wafer(si):205um+30um                                   

Front(-)                Four 1.0 mm silver busbar Silicon nitride anti-reflection coating                     

Back(+)               Full surface aluminum back surface field  2.1mm(silver)  discontinuous                                       soldering pads.

Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC  

Electrical  characteristics

  Physical characteristics:

PACKAGE: 100 PCS /Box

-12 Boxes/CTN

-1200 PCS/CTN

-Gross Weight: 16.8 kg /CTN

- CTN size: 45*25*25mm

Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight. 

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.

Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.

Supply Ability

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Packaging and Shipping

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Packaging details

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